Fabrication of three-dimensional microchannels inside silicon using a femtosecond laser

doi:10.1088/0960-1317/19/12/125007

Fabrication of three-dimensional microchannels inside silicon using a femtosecond laser

Cunxia Li et al 2009 J. Micromech. Microeng. 19 125007 (4pp) doi: 10.1088/0960-1317/19/12/125007

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Cunxia Li, Tao Chen, Jinhai Si, Feng Chen, Xu Shi and Xun Hou
Key Laboratory for Physical Electronics and Devices of the Ministry of Education, Shannxi Key Lab of Information Photonic Technique, School of Electronics and Information Engineering, Xi'an Jiaotong University, Xianning-xilu 28, Xi'an, 710049, People's Republic of China
E-mail: jinhaisi@mail.xjtu.edu.cn and chenfeng@mail.xjtu.edu.cn

Abstract. We report on photo-induced microchannels created within single-crystal silicon using 800 nm femtosecond laser pulses. The 800 nm wavelength is in the absorption region of silicon. Using combined transverse scanning and longitudinal scanning, we can fabricate arbitrary three-dimensional microchannels in the interior of silicon, to a depth of several hundred micrometers, without surface damage. The diameter of the photo-induced microchannels can be controlled by varying laser power, scan velocity and focal depth.

Print publication: Issue 12 (December 2009)
Received 3 August 2009, in final form 23 September 2009
Published 20 October 2009

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Fabrication of three-dimensional microchannels inside silicon using a femtosecond laser

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