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Crystallographic orientation mapping with an electron backscattered diffraction technique in (Bi, Pb)2Sr2Ca2Cu3O10 superconductor tapes

T T Tan et al 2001 Supercond. Sci. Technol. 14 78-84   doi: 10.1088/0953-2048/14/2/304  Help

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T T Tan1, S Li1,4, J T Oh1, W Gao2, H K Liu3 and S X Dou3
1 School of Materials Engineering, Nanyang Technological University, Singapore
2 Department of Chemical and Materials Engineering, The University of Auckland, New Zealand
3 Institute for Superconducting and Electronic Materials, The University of Wollongong, Australia
4 Corresponding author.
E-mail: assxli@ntu.edu.sg

Abstract. It is believed that grain boundaries act as weak links in limiting the critical current density (Jc) of bulk high-Tc superconductors. The weak-link problem can be greatly reduced by elimination or minimization of large-angle grain boundaries. It has been reported that the distribution of the Jc in (Bi, Pb)2Sr2Ca2Cu3O10+x (Bi2223) superconductor tapes presents a parabolic relationship in the transverse cross section of the tapes, with the lowest currents occurring at the centre of the tapes. It was proposed that the Jc distribution is strongly dependent on the local crystallographic orientation distribution of the Bi2223 oxides. However, the local three-dimensional crystallographic orientation distribution of Bi2223 crystals in (Bi, Pb)2Sr2Ca2Cu3O10+x superconductor tapes has not yet been experimentally determined. In this work, the electron backscattered diffraction technique was employed to map the crystallographic orientation distribution, determine the misorientation of grain boundaries and also map the misorientation distribution in Bi2223 superconductor tapes. Through crystallographic orientation mapping, the relationship between the crystallographic orientation distribution, the boundary misorientation distribution and the fabrication parameters may be understood. This can be used to optimize the fabrication processes thus increasing the critical current density in Bi2223 superconductor tapes.

Print publication: Issue 2 (February 2001)
Received 27 June 2000, in final form 17 October 2000

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