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Gas-source molecular beam epitaxy of SiGe virtual substrates: I. Growth kinetics and doping

J M Hartmann et al 2000 Semicond. Sci. Technol. 15 362-369   doi: 10.1088/0268-1242/15/4/310  Help

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J M Hartmann-+, B Gallas-+, R Ferguson-+, J Fernàndez-+, J Zhang-+ and J J Harris-+
-+ Center for Electronic Materials and Devices, the Physics Department, Imperial College of Science, Technology and Medicine, Prince Consort Road, London SW7 2BZ, UK
++ Department of Electronic and Electrical Engineering, University of Central London, Torrington Place, London WC1E 7JE, UK
E-mail: jmhartmann@sorbier.cea.fr

Abstract. We have studied the growth by gas-source molecular beam epitaxy (GS-MBE) of SiGe virtual substrates. We have first determined the relationship existing between the Ge concentration in SiGe thick films and the gas phase ratio of disilane and germane, and its behaviour versus growth temperature. We find that Si atoms are 4.6 times more likely to be incorporated than Ge atoms at 550 °C. This incorporation probability decreases as the growth temperature increases, following a thermally activated law with a 0.082-0.126 eV characteristic energy. The dependence of SiGe growth rate on substrate temperatures has a cross-over point at approximately 8% of Ge, above which the growth rate decreases significantly as the temperature increases . Otherwise, we show what p-type or n-type doping levels are typically achievable in SiGe virtual substrates, and the influence diluted diborane and arsine have on the growth kinetics of SiGe. Additionally, we demonstrate that the `pre-build-up/flash-off' technique originally proposed by Iyer et al for solid-source MBE (1981 J. Appl. Phys. 52 5608) yields abrupt arsenic doping profiles in GS-MBE.

Print publication: Issue 4 (April 2000)
Received 30 September 1999, accepted for publication 4 February 2000

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